Original
Pressure Sensitive and Bonding Adhesives for Packaging Stacked Integrated
Circuits:
Ⅱ. Effects of UV Curing of the Multi-functional Acrylate Component on
the Bonding Strength to
Copper Plate・・・Kazuyoshi EBE, Hiedo SENO, Takashi
SUGINO and Osamu YAMAZAKI
Technical Report
Properties of Epoxy Resin Compounds Modified with Aromatic Olefin Oligomers for Electronic Materials
・・・Naoki
YOKOYAMA, Kiyokazu YONEKURA and Masashi KAJI
Dulabilities of Stressed Adhesive Lap Joints of Stainless Steel Plates
under the High Humidity Conditions
・・・Yasuaki
SUZUKI, Takashi ISHIZUKA and Yuji MIZUTANI
Review
New Applications of Polysilane Films Focusing on UV photodegradation
・・・Yoshiaki
SAKURAI, Norio NAGAYAMA and Masaaki YOKOYAMA
UV Transmittance of Fluoro Plastic and Acrylic Plastic Blends・・・Hideo
HORIBE
Ⅸ.Recent Advancement in Polymer Synthetic Chemistry and the Possible
Application
to Adhesion Technology
(8)Recent Developments in Ring-opening Polymerization・・・Masatoshi
MIYAMOTO
Introduction of the Company・・・Manabu
HASHIMOTO